Technology
Location錛?a href="/en/index.html">Index > Technology
| Number | Parameter | Technical specification | Remarks | |||
| 1 | Layers | 1-16 | 銆� | |||
| 2 | Material | FR-4 CEM-3 CEM-1 FR-1 | Special materials according to customer requirements | |||
| 3 | Finished board thickness | 0.4-6.0MM(15-236mil) | 銆� | |||
| 4 | Min-core thickness | 0.2MM(8mil) | 銆� | |||
| 5 | Resistance welding bridge | 0.076MM(3mil) | 銆� | |||
| 6 | Copper thickness | HOZ 1OZ 2OZ 3OZ | 銆� | |||
| 7 | Min.trace width&line space | double layer | 0.1MM(4mil) | 銆� | ||
| 8 | Multi layer | 0.1MM(4mil) | 銆� | |||
| 9 | Min-hole diameter | Drilling/PTH | 鈭?.15MM(6mil) | 銆� | ||
| 10 | Punching | 鈭?.7MM(28mil) | 銆� | |||
| 11 | Dimension tolerance | Hole position | ±0.05MM(±2mil) | 銆� | ||
| 12 | 錛圵錛塛idth | ±20% | Special case±10% | |||
| 13 | 錛圚錛塇ole diameter | PTH±0.076MM(±3mil) | 銆� | |||
| 14 | 錛圚錛塇ole diameter | NPTH±0.05MM(±2mil) | 銆� | |||
| 15 | Outline dimension | 0.1MM(4mil) | 銆� | |||
| 16 | Conductors&Outline | 0.20MM(8mil) | 銆� | |||
| 17 | Warp and Twist | 0.75% | 銆� | |||
| 18 | Surface treatment |
HAL&Lead Free HAL AU/NI Immersion gold/Immersion sliver/Immersion Tin OSP |
OSP 錛?Immersion gold錛?gold finger錛宯o peel錛?/td> | |||
| 19 | ET | Number of tests 錛圡AX錛?/td> | ET machine:12288 point錛?/td> | 銆� | ||
| Insulation resistance testing錛圡AX錛?/td> | 50MΩ | 銆� | ||||
| Conduction resistance test錛圡IN錛?/td> | ET machine錛?0Ω | 銆� | ||||
| Testing the size of PAD錛圡IN錛?/td> | 0.25MM(10mil) | 銆� | ||||
| Welding test plate of center distance錛圡IN錛?/td> | 0.2MM(8mil) | 銆� | ||||
| Testing Voltage錛圡AX錛?/td> | 500V | 銆� | ||||
| High Voltage test voltage錛圡AX錛?/td> | 5000V | 銆� | ||||
| High voltage test leakage voltage錛圡IN錛?/td> | 10uA | 銆� | ||||
| Testing the size of PCB | 450*965MM | 銆� | ||||
| Testing the thickness of plating | 0.4-6.0MM(15-236mil) | 銆� | ||||
